gnupic@linuxhacker.org

On Tue, Oct 21, 2003 at 11:57:31AM -0500, Martin McCormick wrote:
> The other big win is something that most of you don't have to
> deal with much and that is manageable documentation.

Add a piezo element between an I/O pin and ground, with 10k from pin 
to supply.  When the input pin goes low, wait a second, then emit a 
morse code representation of the documentation reference URL.  ;-)

Obligatory GNUPIC reference: perhaps there's an open source morse code 
reader.

> I tend to use wire-wrap on the IC sockets and solder any wires that go
> to components since the round leads don't secure the wrap at all ...

Yes, wire-wrap connects at the corners, and it is the deformation of the
metal in the pin and the wire that achieves connection and retention.
The insulation also forms part of the stress relief.  For the wire.  ;-)

Suggestions: 

1.  use strong flat surfaced pliers to change the cross-section of the 
round leads into a rectangle, then apply the wire-wrap.  This increases
the retention.

2.  place a wire-wrap pin next to the component lead on the proto board,
and wrap the lead once around the base of the pin and solder that, then
trim the excess lead.  This lets you change your design without using
the soldering iron.

-- 
James Cameron    mailto:quozl@us.netrek.org     http://quozl.netrek.org/